Samtec Inc. EJH-111-02-S-D-TH
- EJH-111-02-S-D-TH
- Samtec Inc.
- .100 X .100 EJECTOR HEADER ASSEM
- Rectangular Connectors - Headers, Male Pins
- EJH-111-02-S-D-TH Gegevensblad
- -
- -
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Lead free / RoHS Compliant
- 3117
- Spot inventaris/geautoriseerde distributeurs/fabrieksoverschot inventaris
- 1 jaar kwaliteitsborging 》
- Klik om tarieven te zien
Part Number EJH-111-02-S-D-TH |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description .100 X .100 EJECTOR HEADER ASSEM |
Package - |
Series EJH |
Features Keying Slot |
Operating Temperature -55°C ~ 125°C |
Mounting Type Through Hole |
Termination Solder |
Style Board to Cable/Wire |
Current Rating 3A |
Contact Material Phosphor Bronze |
Number of Positions 22 |
Connector Type Header |
Number of Positions Loaded All |
Number of Rows 2 |
Insulation Color Natural |
Contact Type Male Pin |
Fastening Type Latch Lock/Eject Hooks |
Pitch - Mating 0.100" (2.54mm) |
Shrouding Shrouded - 4 Wall |
Contact Length - Mating 0.225" (5.72mm) |
Contact Length - Post 0.120" (3.05mm) |
Insulation Height 0.500" (12.70mm) |
Contact Shape Square |
Contact Finish - Mating Gold |
Contact Finish - Post Tin |
Insulation Material Liquid Crystal Polymer (LCP) |
Row Spacing - Mating 0.100" (2.54mm) |
Package_case - |
EJH-111-02-S-D-TH Garanties
• Reageer snel
• Gegarandeerde kwaliteit
• Wereldwijde toegang
• Concurrerende marktprijs
• One-stop-services van de toeleveringsketen
Jinftry, het is uw meest betrouwbare leverancier van componenten, welkom om ons de aanvraag te sturen, dank u!
Heb je vragen over EJH-111-02-S-D-TH ?
Voel je vrij om contact met ons op te nemen:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( E-mail eerst wordt op prijs gesteld )
Opmerkingen
Samtec Inc.
![Samtec Inc.](https://nl.jinftry.com/image/catalog/manufacturer/logos/samtec.png)
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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